USC | 產品封裝資訊| 臺灣東芝電子零組件股份有限公司

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USC. In developing your designs, please ensure the datasheet. USCpackage. Toshiba Package Code, 1-1E1S. Package Code, SOD-323. Mounting, Surface Mount. 半導體&儲存產品首頁 Semiconductor 開發/設計支援 Package&PackingInformation 產品詳細 USC Indevelopingyourdesigns,pleaseensurethedatasheet. USCpackage ToshibaPackageCode 1-1E1S PackageCode SOD-323 Mounting SurfaceMount Pins 2 Width×Length×Height(mm) 2.5×1.25×0.9 Landpattern(2DModel) Cadence DXF LPB Zuken 3DModel STEP PackageDimensions(mm)/Landpatterndimensionsforreferenceonly(mm) PackingMethod EmbossedTape PackingName TPH3 MinimumQuantity 3000pcs/Reel TapeWidth(mm) 8 TapeDimensions(mm)/ReelDimensions(mm) DownloadpackagedataforCADtool,suchas3DmodeldatainSTEPformatandreferencelandpatterndatadesignedfollowingJEITAET-7501Level3. 3Dmodel(.stp)：3DmodelDatainSTEPFormat LandPattern(.dxf)：LandpatternDatainDXFFormat LandPattern(.xml)：LandpatternDatainJEITALPBC-format LandPattern(.dra)：LandpatternDataforCadence®OrCAD® LandPattern(.ftp)：LandpatternDataforZuken®CR-5000/CR-8000 JumptoPackage&PackingInformation 開啟新視窗 ToTop

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